3215 32.768K 12.5PF 20PPM

　 Low ESR 50 kΩ Max. 32.768 kHz Crystal Unit: FC3215AN Features ● Package size: ● Nominal frequency range: ● Frequency tolerance: ● Operating temperature: ● ESR: 3.2 x 1.5 mm, t = 0.9 mm Max. 32.768 kHz ±20 x 10-6 (+25 °C ± 5 °C) -40 °C to +105 °C 35 kΩ Typ. (+25 °C) 50 kΩ Max. (-40 °C to +85 °C) 60 kΩ Max. (-40 °C to +105 °C) FC3215AN (3.2 x 1.5 mm, t = 0.9 mm Max.) Applications ● Wireless Modules for Sub-clock ● Wearable Products ● Low Power MCUs for Sub-clock ● Battery Powered IoT Products Description FC3215AN is a low ESR and compact 32.768 kHz crystal unit that has a robust Pb-free metal lid + seam sealed package. It is equipped with a newly redesigned crystal element based on our in-house design and production technology expertise of tuning-fork crystal devices over the decades. It is ideal for applications that require low current consumption, such battery powered IoT devices . It also supports an operating temperature range of up to +105 °C. Outline Drawing and Terminal Assignment Typical Performance 　　Low ESR 0.9 Max. 1. 5±0.1 3.2±0.1 1.7 #2 Internal Connection 1.3 0.65 #1 #1 0.15 Pin Connection #1 X'tal #2 X'tal #2 Page 1 / 8 Spec No FC3215AN_E_Ver1.1 [ 1 ] Product Number / Product Name (1-1) Product Number 　　　　X1A000161xxxx16　　(Please contact Epson for details) (1-2) Product Name (Standard Form) 　　　FC3215AN 　32.768000kHz 　12.5 　+20.0-20.0 　　　　　①　　　　　②　　　　　 ③　　　　④ ①Model　②Frequency　③Load capacitance (pF) ④Frequency tolerance (x10-6, +25 °C) [ 2 ] Absolute Maximum Ratings Rating value Item Storage temperature range Maximum level of drive Symbol Unit Min. Typ. Max. T_stg -55 - +125 °C GL - - 0.5 μW Note [ 3 ] Operating Conditions Rating value Item Operating temperature range Level of drive Symbol Unit Min. Typ. Max. T_use -40 - +105 °C DL 0.01 0.1 0.5 μW Note [ 4 ] Static Characteristics Symbol Specifications Unit f_nom 32.768 kHz Frequency tolerance f_tol ±20 Turnover temperature Ti +25 ± 5 Item Nominal frequency range Parabolic coefficient B -0.04 Max. x10 -6 Condition / Remarks T_use = +25 °C ± 3 °C DL = 0.1 μW This is not include frequency aging °C -6 x10 / °C2 35 Typ. (+25 °C) Motional resistance (ESR) R1 50 Max. (-40 °C to +85 °C) kΩ Measuring instrument: Keysight 4294A DL = 0.5 μW 60 Max. (-40 °C to +105 °C) Motional capacitance C1 8.4 Typ. fF Shunt capacitance C0 1.6 Typ. pF Load capacitance CL 9, 12.5 pF Isolation resistance IR 200 Min. MΩ f_age ±3 x10-6 Frequency aging Page 2 / 8 T_use = +25 °C, First year, DL = 0.1 μW Spec No FC3215AN_E_Ver1.1 [ 5 ] Frequency and ESR vs. Temperature Characteristics n = 26 n = 26 35 kΩ Typ. at +25 °C Page 3 / 8 Spec No FC3215AN_E_Ver1.1 [ 6 ] Marking Description Internal ID Frequency symbol A: 32.768 kHz AA9T 088 Date of manufacture (Table 2.) Year of manufacture (Last digit of the year) Month of manufacture (Table 1.) Table 1. Month of manufacture Month Jan Code 1 Feb 2 Mar 3 Apr 4 May 5 Jun 6 Jul 7 Aug 8 Sep 9 Oct X Nov Y Dec Z 　　　　 Table 2. Date of manufacture Date 1st 2nd 3rd 4th 5th 6th 7th 8th 9th 10th 11th 12th Code 1 2 3 4 5 6 7 8 9 A B C Date 13th 14th 15th 16th 17th 18th 19th 20th 21st 22nd 23rd 24th Code D E F G H J K L M N P Q Date 25th 26th 27th 28th 29th 30th 31st Code R S T U V W X [ 7 ] Outline Drawing and Recommended Footprint 2.5 Unit: mm 1.8 1.5 ± 0.1 3.2 ± 0.1 0.15 0.9 Max. 1.0 #1 0.65 #2 1.3 1.7 *Do not design any circuit patterns in the shaded area. Internal Connection #1 Pin Connection #1 #2 X'tal X'tal #2 Reference weight Typ.: 13 mg 　　　Terminal coating: Au plating Page 4 / 8 Spec No FC3215AN_E_Ver1.1 [ 8 ] Moisture Sensitivity Level Specification LEVEL1 Parameter MSL Conditions IPC/JEDEC J-STD-020D.01 [ 9 ] Reflow Profile (IPC/JEDEC J-STD-020D.01) Temperature [ C ] 300 ; +260 C OVER TP +255 C 250 200 150 TL ; +217 C Ts max ; +200 C Ts min ; +150 C tp ; at least 30 s Ramp-up rate +3 °C/s Max. tL Ramp-down rate -6 °C/s Max. 60 s to 150 s ( +217 C over ) ts 60 s to 120 s 100 ( +150 C to +200 C) 50 Time +25 C to Peak 0 60 120 180 240 300 360 420 480 540 600 660 720 780 Time [ s ] Page 5 / 8 Spec No FC3215AN_E_Ver1.1 [ 10 ] Packing Information 　　(1) Packing Quantity The last two digits of the Product Number (X1A000161xxxx16) are a code that defines the packing quantity. The standard is "16" for a 3 000 pcs/Reel. 　(2) Taping Specification Compliant to EIA-481, IEC 60286 and JIS C0806 (2-1) Tape Dimensions Carrier Tape Material : PS (Polystyrene) Top Tape Material : PET (Polyethylene Terephthalate) +PE (Polyethylene) Unit : mm 4.0±0.1 0.3±0.05 3.6±0.1 Epson +0.2 Φ1.0 -0 1.0±0.1 12.1±0.2 2.0±0.05 4.0±0.1 5.5±0.05 +0.1 Φ1.5 -0 1.75±0.1 10P：40±0.1 1.9±0.1 User direction of feed (2-2) Reel Dimensions Center Material : PS (Polystyrene) Reel Material : PS (Polystyrene) Φ180 +0 -3.0 15.4±1 Φ60 Φ76 Φ160 13±0.3 Φ3 +0.3 2 -0 Φ13±0.2 Φ21±0.8 Page 6 / 8 Spec No FC3215AN_E_Ver1.1 [ 11 ] Handling Precautions Prior to using this product, please carefully read the section entitled “Precautions” on our Web site (https://www5.epsondevice.com/en/information/#precaution) for instructions on how to handle and use the product properly to ensure optimal performance of the product in your system. Before using the product under any conditions other than those specified therein, please consult with us to verify and confirm that the performance of the product will not be negatively affected by usage under such conditions. In addition to the foregoing precautions, in order to avoid the deteriorating performance of the product, we strongly recommend that you DO NOT use the product under ANY of the following conditions: 1. This product should be reflowed no more than 3 times. If rework is needed after reflow, please correct it with a soldering iron with the tip set for a temperature of +350 °C or less and only contact each terminal once and for no more than 5 seconds. If this product is mounted on the bottom of the board during a reflow please check that it soldered down properly afterwards. 2. This product can be damaged by mechanical shock during the soldering process depending on the equipment used, process conditions, and any impact forces experienced. Always follow appropriate procedures, particularly when changing the assembly process in anyway and be sure to follow applicable process qualification standards before starting production. 3. Product failures during the warranty period only apply when the product is used according to the recommended operating conditions described in the specifications. Products that have been opened for analysis or damaged will not be covered. It is recommended to store and use in normal temperature and humidity environments described in the specifications to ensure frequency accuracy and prevent moisture condensation. If the product is stored for more than one year, please confirm the pin solderability prior to use. 4. Keep PCB routing from the output terminal(s) to the load as short as possible for best performance. 5. The use of ultrasonic technology for cleaning, bonding, etc. can damage the Xtal unit inside this product. Please carefully check for this consideration before using ultrasonic equipment for volume production with this product. 6. If the oscillation circuit is exposed to condensation, the frequency may change or oscillation may stop. Do not use in any conditions where condensation occurs. 7. If an excessive excitation is applied to the crystal unit, the characteristics may be degraded or destruction may occur. Design the oscillation circuit so that the excitation level is appropriate. 8. Depending on the method and conditions used to measure characteristic values such as frequency, deviation from our measured values may occur. Please check and verify the characteristics before use. 9. Do not route any signal lines, supply voltage lines, or GND lines underneath the area where the oscillators are mounted including any internal layers and on the opposite side of the PCB. To avoid any issues due to interference of other signal lines, please take care not to place signal lines near the product as this may have an adverse affect on the performance of the product. 10. If sufficient negative resistance is not provided by the oscillation circuit, the Xtal may not oscillate or take a long time to start. Please design the circuit as follows: How to check the negative resistance. Rf Rd X'tal Cg R Cd (1) Connect the resistance (R) to the circuit in series with the crystal resonator. (2) Adjust (R) so that oscillation can start (or stop). (3) Measure (R) when oscillation just start (or stop) per instruction in (2) above. (4) Get the negative resistance -R = R + R1 value. (5) Recommended -R -R > R1 x 5 Page 7 / 8 Spec No FC3215AN_E_Ver1.1 PROMOTION OF ENVIRONMENTAL MANAGEMENT SYSTEM CONFORMING TO INTERNATIONAL STANDARDS At Seiko Epson, all environmental initiatives operate under the Plan-Do-Check-Action (PDCA) cycle designed to achieve continuous improvements. The environmental management system (EMS) operates under the ISO 14001 environmental management standard. All of our major manufacturing and non-manufacturing sites, in Japan and overseas, completed the acquisition of ISO 14001 certification. ISO 14000 is an international standard for environmental management that was established by the International Standards Organization in 1996 against the background of growing concern regarding global warming, destruction of the ozone layer, and global deforestation. WORKING FOR HIGH QUALITY In order provide high quality and reliable products and services than meet customer needs, Seiko Epson made early efforts towards obtaining ISO9000 series certification and has acquired ISO9001 for all business establishments in Japan and abroad. We have also acquired IATF 16949 certification that is requested strongly by major manufacturers as standard. IATF 16949 is the international standard that added the sectorspecific supplemental requirements for automotive industry based on ISO9001. ■ Explanation of marks used in this datasheet ●Pb free. ●Complies with EU RoHS directive. *About the products without the Pb-free mark. Contains Pb in products exempted by EU RoHS directive (Contains Pb in sealing glass, high melting temperature type solder or other) NOTICE: PLEASE READ CAREFULLY BELOW BEFORE THE USE OF THIS DOCUMENT ©Seiko Epson Corporation 2020 1. The content of this document is subject to change without notice. 　Before purchasing or using Epson products, please contact with sales representative of Seiko Epson Corporation (“Epson”) for the latest information and be always sure to check the latest information published on Epson’s official web sites and resources. 2. This document may not be copied, reproduced, or used for any other purposes, in whole or in part, without Epson’s prior consent. 3. 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If exporting Epson products or our associated technologies, please be sure to comply with the Foreign Exchange and Foreign Trade Control Act in Japan, Export Administration Regulations in the U.S.A (EAR) and other export-related laws and regulations in Japan and any other countries and to follow their required procedures. 9. Epson assumes no responsibility for any damages (whether direct or indirect) caused by or in relation with your non-compliance with the terms and conditions in this document or for any damages (whether direct or indirect) incurred by any third party that you give, transfer or assign Epson products. 10. For more details or other concerns about this document, please contact our sales representative. 11. Company names and product names listed in this document are trademarks or registered trademarks of their respective companies. Page 8 / 8 Spec No FC3215AN_E_Ver1.1